The annual global semiconductor conference SEMICON Taiwan 2025 officially debuted this week. It was first opened today (8th) by the "Silicon Photonics International Forum". Taiwan Chief Huang Shifen also shared the current situation of Tai...
The annual global semiconductor conference SEMICON Taiwan 2025 officially debuted this week. It was first opened today (8th) by the "Silicon Photonics International Forum". Taiwan Chief Huang Shifen also shared the current situation of Taiwan's silicon photonic engine COUPE in the forum.
Huang Shifen pointed out that the power of silicon photonic technology is that it can use wavelength division multiplexing (WDM) on a single optical fiber, just as electrical connections must be expanded by adding a guide line, and optical interconnections can continue to be expanded along multiple dimensions. From single to dense WDM, you can even use multiple different color wavelengths in the same light wave in the future, and then combine with advanced modulation techniques to further increase the amount of data that each symbol can carry. This multi-dimensional expansion capability is the key to silicon photons meeting the AI large data needs.
He further introduced that the TECHNOLOG HPC technology platform combines advanced logical chips with high-performance memory (HBM), then adds inductors and capacitors, and integrates advanced 3D packaging and silicon photon solutions. The optical engine can be placed directly on the substrate or installed on an interposer according to application requirements.
Later, Huang Shifen demonstrated the silicon photonic platform of NTF, "COUPE", which uses SoIC technology, which means that the EIC (electronic overall circuit) is directly coupled to the PIC (photon overall circuit) through the copper-to-copper; all key components are integrated into the PIC, as well as an advanced 200G microcircuit transducer (MRM); then, the wafer is covered with an oxidation layer, coupled with another silicon wafer, and through dielectric through holes (dielectric). via) Open the hole from the back to complete the electrical connection to the substrate.
Husfen emphasized that the modulator is another extremely important component in the PIC. Among them, the regulator mainly includes micro-regulator (MRM) and MZM regulator. Looking ahead, NTU will continue to focus on higher frequency width, faster speed and higher energy efficiency, and will actively explore new materials beyond silicon.
Finally, Huang Shifen also said that the combination of advanced integration of photonic technology will provide a new path for the development of AI. Looking ahead, I believe that the continuous innovation in photonic technology and co-packaging will unblock the new generation of AI systems.
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