This article is cooperating with Tuoyuan Industrial Research Institute, and the reproduced content is part of the essence. To purchase the complete report, please contact Tuoyuan’s official website This article will take you through: OCP 2025 displa...
This article is cooperating with Tuoyuan Industrial Research Institute, and the reproduced content is part of the essence. To purchase the complete report, please contact Tuoyuan’s official website
This article will take you through: OCP 2025 display heat dissipation is being partially strengthened from the past, entering into the systematic reconstruction of components, complete machines, and data centers. Meta updates DSF technical details to accelerate the development of Scale-Across. The ESUN alliance is established, based on Broadcom's SUE 1.0, which will help more Switch IC manufacturers join the Scale-Up market. Zhibang, Celestica, and Mingtai demonstrate 1.6Tbps Switch, and mass production is expected to begin in 2026. Intel launches new GPU Crescent Island, for Inference Prefill application Solidigm introduces Direct-to-Chip cold plate liquid cooling into SSD to avoid high-temperature performance degradation under high-speed access; DUG uses immersion liquid cooling combined with containerized data center Nomad to make computing power mobile and quickly deployable. This article will take you through: OCP 2025 display heat dissipation is being partially strengthened from the past, entering into the systematic reconstruction of components, complete machines, and data centers. Meta updates DSF technical details to accelerate the development of Scale-Across. The ESUN alliance is established, based on Broadcom's SUE 1.0, which will help more Switch IC manufacturers join the Scale-Up market. Zhibang, Celestica, and Mingtai demonstrate 1.6Tbps Switch, and mass production is expected to begin in 2026. Intel launches new GPU Crescent Island, for Inference Prefill application
