According to market news, China's major memory manufacturer Chang Xin Memory (CXMT) has made a major breakthrough and shipped HBM3 samples to Chinese AI giants such as Huawei to alleviate the HBM crisis. It is reported that Changxin Memory plans...
According to market news, China's major memory manufacturer Chang Xin Memory (CXMT) has made a major breakthrough and shipped HBM3 samples to Chinese AI giants such as Huawei to alleviate the HBM crisis.
It is reported that Changxin Memory plans to bring HBM3E to China in 2027 and expects to start mass production this year to capture the current DRAM demand. The fact that Beijing has long faced HBM supply bottlenecks and relied on pre-export control HBM inventories has also become an obstacle for companies such as Huawei to expand AI chip production capacity. Only recently have Chinese companies gradually acquired sufficient technology and production capabilities.
Some analysts pointed out that although Changxin memory technology is still three to four years behind the world's top companies, its progress marks an important step in China's semiconductor independence and may also break the long-term dominance of international DRAM manufacturers.
Despite lagging technology, Changxin Memory still plays a key role in overall DRAM production because the company has sufficient production lines. The company will continue to increase its DRAM production capacity this year, and it is expected that the monthly production capacity of the Chinese factory will reach 230,000 to 280,000 wafers.
Currently, Changxin Memory still lags behind SK Hynix and other companies, and plans to bring HBM3E to China in 2027, by which time HBM4 is expected to become a mainstream standard. At the same time, the company has also gained a leading position in the consumer memory field, and the company has begun mass production of DDR5 modules with a reported yield rate of about 80%.
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